PRODUCTS
Film for semiconductor packaging
Features:
● Semiconductor QFN/DFN packaging film;
● PI adhesive layer with heat resistant molecular design;
● No exhaust, no residue, no injury
Category:
Film for semiconductor packaging
Features:
● Semiconductor QFN/DFN packaging film;
● PI adhesive layer with heat resistant molecular design;
● No Out-gassing, No Residue, No Bleeding
| ICF™-LFB (Semiconductor QFN/DFN Packaging Film) | |||
| Type | L | H | ICF_205LD |
| Taping Temp | ~ 100 ℃ | 220~250 ℃ | 225 ℃ |
| De-taping Temp | R.T.* | R.t.~ 200 ℃ | |
| Decomposite Temp | ~ 400 ℃ | 400 ℃ | 400 ℃ |
| Peel strength after Wire Bond | 190gf/cm (200℃, 90min) | ~ 250gf/cm (200 ℃, 90min → 230 ℃, 30min) | 700gf/cm (225℃, 90min) |
| Adhesive layer thickness | 3~5 | 1.5. | 1 |
| Residue after De-taping | None | ||
| CTE | ~20 | ||
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Contact Information
Address: No.29 Kaixuan Road, Qiting Street, Yixing City,Jiangsu Province, China
Tel: +86-510-87210188
Tel:+86-18115338897
Contact: Mr. Han
E-mail: sales@yx-ipitech.com
Links: https://www.rianlon.com/cn/