NEWS CENTER
Global flexible AMOLED substrate PI paste market size will exceed $0.4 billion by 2025
With the continuous upgrading and iteration of AMOLED technology, various application products of display panel are advancing along the direction of rigidity → curved surface → foldable → rollable. The core demand of flexible AMOLED is light and thin, bendable, and flexible and foldable, which requires replacing rigid materials in the display screen with flexible materials.
2024/08/26
Application and R & D of Polyimide (PI) in Electronic Industry
Polyimide (PI) is a kind of high-performance polymer material, which is widely used in electronic industry because of its good thermal stability, mechanical properties, insulation properties and good chemical stability. With the rapid development of science and technology, the development and manufacturing of polyimide-related products has become an important part of the industry.
2021/11/12
Widely used in electronics, aerospace, biomedical and other fields. With the rapid development of science and technology, the demand for polyimide materials is increasing, and the importance of its research and development and production technology is becoming more and more prominent.
2021/11/12
Growth and Forecast of Global PI Paste Market for Flexible AMOLED Substrate from 2022 to 2025
PI material realizes the curved surface and foldable function of OLED screen. In the field of electronic display, the growth of PI demand is mainly driven by the development of flexible AMOLED technology.
2024/08/26
IC Packaging Substrate Technology
The IC package substrate is an important component material of the semiconductor package, which is used to carry the chip and provide electrical connection, protection, support and heat dissipation for the chip. In order to achieve the system-level integration requirements of 3D-SiP and meet the needs of high-end applications such as 5G and high-performance computers in the future, the industry has proposed requirements for advanced substrates to increase wiring density, reduce line width and line spacing, reduce size and weight, and improve thermal performance.
2021/11/09
Contact Information
Address: No.29 Kaixuan Road, Qiting Street, Yixing City,Jiangsu Province, China
Tel: +86-510-87210188
Tel:+86-18115338897
Contact: Mr. Han
E-mail: sales@yx-ipitech.com
Links: https://www.rianlon.com/cn/