PRODUCTS
Film for Double Layer Flexible Copper Clad Laminate (FCCL)
Features:
● Double-sided coating with strict thickness control standards;
● Can produce diversified products of different thickness;
● The current mass-produced TPI film thickness specifications are: 12/20/25/50um
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Film for semiconductor packaging
Features:
● Semiconductor QFN/DFN packaging film;
● PI adhesive layer with heat resistant molecular design;
● No exhaust, no residue, no injury
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Features:
The use of TPI film, and polymer resin, metal, ceramic and other materials bonding;
TPI film Tg value can be adjusted according to the pressing temperature
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Contact Information
Address: No.29 Kaixuan Road, Qiting Street, Yixing City,Jiangsu Province, China
Tel: +86-510-87210188
Tel:+86-18115338897
Contact: Mr. Han
E-mail: sales@yx-ipitech.com
Links: https://www.rianlon.com/cn/