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IPI-H paste for flexible substrate

Features: ● Developed for flexible OLED circuit boards, with very high decomposition strength and very low thermal expansion coefficient. ● OLED TFT process, LLO (laser lift-off) can be performed after the process is completed. ● Substrations for thin film flexible solar cells can be applied.

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PI Varnish

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IPI-H paste for flexible substrate

Features:

● Developed for flexible OLED circuit boards, with very high decomposition strength and very low thermal expansion coefficient.

● OLED TFT process, LLO (laser lift-off) can be performed after the process is completed.

● Substrations for thin film flexible solar cells can be applied.

 

Classification Characteristics
Type high heat resistance
Glass transition temperature (Tg) > 340°C (thermal plasticity)
Thermal decomposition temperature (Td 1 wt% loss) ~ 600 ℃
Coefficient of thermal expansion (CTE @ 30~450 ℃) <5 ppm/℃

 

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Yixing IPI

Contact Information

Address: No.29 Kaixuan Road, Qiting Street, Yixing City,Jiangsu Province, China 
Tel: +86-510-87210188
Tel:+86-18115338897
Contact: Mr. Han
E-mail: sales@yx-ipitech.com

Links: https://www.rianlon.com/cn/

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