NEWS CENTER
WLCSP Wafer Level Chip Packaging Technology
Release time:
2021-11-09
WLCSP(Wafer Level Chip Scale Packaging) is a wafer-level chip packaging method, which is different from the traditional chip packaging method (cutting and sealing, and increasing the volume of the original chip by at least 20% after packaging). This latest technology is to package and test the whole wafer before cutting into IC particles one by one, so the packaged volume is equivalent to the original size of the IC bare crystal.
WLCSP(Wafer Level Chip Scale Packaging) is a wafer-level chip packaging method, which is different from the traditional chip packaging method (cutting and sealing, and increasing the volume of the original chip by at least 20% after packaging). This latest technology is to package and test the whole wafer before cutting into IC particles one by one, so the packaged volume is equivalent to the original size of the IC bare crystal.
The packaging method of WLCSP not only significantly reduces the size of memory modules, but also meets the high-density requirements of mobile devices for body space; on the other hand, in terms of performance, it improves the speed and stability of data transmission.
WLCSP Features Benefits
-Original chip size minimum package:
The most important feature of WLCSP wafer-level chip packaging is to effectively reduce the packaging volume, so it can be used on mobile devices to meet the characteristics of portable products, thin and short.
-Short data transmission path and high stability:
When using WLCSP package, because the circuit wiring line is short and thick (yellow line marked A to B), it can effectively increase the frequency of data transmission, reduce current consumption, and improve the stability of data transmission.
Good heat dissipation characteristics
Because WLCSP has less traditional sealed plastic or ceramic packaging, the heat energy of IC chip operation can be effectively dissipated without increasing the temperature of the main body, which is greatly helpful to the heat dissipation problem of mobile devices.
WLCSP can be divided into two structural types: direct BOP(bump on pad) and rewiring (RDL).
BOP means that the tin ball grows directly on the die's Al pad. Sometimes, if the pad leading out the tin ball is closer and it is not convenient to get out of the ball, the solder ball is led to the side by rewiring (RDL).
The earliest WLCSP was Fan-In, Bump was all grown on die, and the connection between die and pad was mainly by metal line of RDL, and the packaged IC was almost close to die area. Fan-out,bump can grow to the outside of die, and the packaged IC is larger than die (1.2 times).
Fan-in: The following process is the RDL production process of Fan-in.
Fan-Out: First cut the die from the wafer and stick it on the carrier plate upside down (Carrier). At this time, the carrier plate and die are bonded to form a new wafer, called a reconstituted wafer (Reconstituted Wafer). In the reconstituted wafer, the long RDL is re-exposed.
The comparison between Fan-in and Fan-out is as follows. From the process point of view, Fan-out is basically the same as Fan-in RDL except for recombining wafers.
Previous
Next
Previous:
Next:
Related News
Contact Information
Address: No.29 Kaixuan Road, Qiting Street, Yixing City,Jiangsu Province, China
Tel: +86-510-87210188
Tel:+86-18115338897
Contact: Mr. Han
E-mail: sales@yx-ipitech.com
Links: https://www.rianlon.com/cn/