
NEWS CENTER
Flexible LED screen introduction
Flexible LED displays have revolutionized the way we perceive visual displays, providing a dynamic and versatile alternative to traditional rigid LED panels.
2024/08/26
WLCSP Wafer Level Chip Packaging Technology
WLCSP(Wafer Level Chip Scale Packaging) is a wafer-level chip packaging method, which is different from the traditional chip packaging method (cutting and sealing, and increasing the volume of the original chip by at least 20% after packaging). This latest technology is to package and test the whole wafer before cutting into IC particles one by one, so the packaged volume is equivalent to the original size of the IC bare crystal.
2021/11/09
Contact Information
Address: No.29 Kaixuan Road, Qiting Street, Yixing City,Jiangsu Province, China
Tel: +86-510-87210188
Tel:+86-18115338897
Contact: Mr. Han
E-mail: sales@yx-ipitech.com
Links: https://www.rianlon.com/cn/