NEWS CENTER
Growth and Forecast of Global PI Paste Market for Flexible AMOLED Substrate from 2022 to 2025
PI material realizes the curved surface and foldable function of OLED screen. In the field of electronic display, the growth of PI demand is mainly driven by the development of flexible AMOLED technology.
2024/08/26
IC Packaging Substrate Technology
The IC package substrate is an important component material of the semiconductor package, which is used to carry the chip and provide electrical connection, protection, support and heat dissipation for the chip. In order to achieve the system-level integration requirements of 3D-SiP and meet the needs of high-end applications such as 5G and high-performance computers in the future, the industry has proposed requirements for advanced substrates to increase wiring density, reduce line width and line spacing, reduce size and weight, and improve thermal performance.
2021/11/09
Flexible LED screen introduction
Flexible LED displays have revolutionized the way we perceive visual displays, providing a dynamic and versatile alternative to traditional rigid LED panels.
2024/08/26
WLCSP Wafer Level Chip Packaging Technology
WLCSP(Wafer Level Chip Scale Packaging) is a wafer-level chip packaging method, which is different from the traditional chip packaging method (cutting and sealing, and increasing the volume of the original chip by at least 20% after packaging). This latest technology is to package and test the whole wafer before cutting into IC particles one by one, so the packaged volume is equivalent to the original size of the IC bare crystal.
2021/11/09
Contact Information
Address: No.29 Kaixuan Road, Qiting Street, Yixing City,Jiangsu Province, China
Tel: +86-510-87210188
Tel:+86-18115338897
Contact: Mr. Han
E-mail: sales@yx-ipitech.com
Links: https://www.rianlon.com/cn/